TSMC in spat with Intel
By David Manners, ElectronicsWeekly (December 7, 2021)
Last weekend TSMC chairman Mark Liu took Intel to task over its efforts to persuade the US government only to support domestic US chip companies.
’Not too many people will believe what Intel says,” said Liu, “it will be very negative for the US to subsidise only American companies. Unlike Intel, TSMC is very positive about non-US chipmskers expanding capacity in America. It is a great thing. This shows our decision two years ago is correct.”
To read the full article, click here
Related Semiconductor IP
- AXI to UCIe FDI Interface IP
- 45SPCLO UCIe-Class 1-32Gbps Low Power Receiver IP (NRZ)
- 45SPCLO UCIe-Class 1-32Gbps Low Power Transmitter IP (NRZ)
- Peripheral Sensor Interface (PSI5) Host Controller
- Link Acceleration Unit
Related News
- U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
- GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
- Key ASIC Signed LOI to Acquire Wafer FAB in The US
- Intel German fab in doubt
Latest News
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’
- OpenAI and Broadcom unveil LLM-optimized inference chip
- RAAAM Selects Avnet ASIC as its VCA Partner for TSMC’s 2nm GCRAM Development and Qualification