TSMC Files Law Suit Against SMIC for Patent Infringement and Trade Secret Misappropriation
Hsinchu, Taiwan, December 22, 2003
- Taiwan Semiconductor Manufacturing Company (TSMC) (TSE: 2330, NYSE: TSM), TSMC North America and WaferTech filed a complaint in the US District Court of Northern California on December 19th against Semiconductor Manufacturing International Corporation (SMIC) and SMIC Americas alleging that SMIC has infringed multiple patents and misappropriated trade secrets. The suit also asks for injunctive relief along with monetary damages.
The complaint alleges that SMIC improperly obtained TSMC trade secrets and infringed TSMC patents. For example, the complaint states that SMIC hired over 100 TSMC employees and asked some of them to provide SMIC with TSMCâs trade secrets. The suit alleges that a SMIC official asked a then-TSMC manager to obtain TSMC process information and forward it to SMIC.
âWe feel that we have no other choice than to proceed through the courts in order to protect our technology,â said Dr. Dick Thurston, Vice President and General Counsel for TSMC. âIt is our obligation to protect our patents and trade secrets to maintain shareholder value,â Dr. Thurston explained.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at its wholly owned subsidiary, WaferTech, and its joint venture fab, SSMC. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC's corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
Issued by: Taiwan Semiconductor Manufacturing Company
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Credo Files AEC Patent Infringement Complaint Against Amphenol, Molex, TE Connectivity, and Volex with United States International Trade Commission
- QUALCOMM Sues Broadcom for Misappropriation of Trade Secrets and Patent Infringement
- Silicon Image Sues Analogix Semiconductor for Copyright Infringement and Misappropriation of Trade Secrets
- UMC Files Patent Infringement Lawsuit against Micron
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release