TSMC Expansion in Arizona to Target 3-nm Node
By Alan Patterson, EETimes (November 14, 2022)
Taiwan Semiconductor Manufacturing Co. (TSMC) announced this week that it’s building the factory shell for a possible second fab at its Arizona site. The world’s top chipmaker has already committed to a $12 billion investment for its 5-nm fab in Arizona.
In an email to EE Times, the company said it is “now constructing” a building to potentially serve as a second fab in Arizona that would help achieve greater cost effectiveness at the new site.
TSMC has led a wave of new fab investments in the U.S. as part of a national effort to rebuild the domestic semiconductor industry centered around the CHIPS Act. When the first TSMC Arizona fab starts production in 2024, it will produce 5-nm chips—the most advanced in the U.S.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Chips&Media Secures Access to TSMC 3nm Library
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
Latest News
- SEMIFIVE Accelerates Growth with 97% YoY Revenue Surge in H1 2026, Powered by ASIC Turnkey, Mass Production, and IP
- Andes Technology has shut down Condor Computing
- TIER IV joins JST’s Next-Generation Edge AI Semiconductor R&D Program to open-source AI chip designs for autonomous driving
- BrainChip Partners With Orama.AOI For AI-Fueled Defect Detection
- PUFsecurity, subsidiary of eMemory, Advances Hardware-anchored Trust for AI Infrastructure at OCP APAC 2026