Tsinghua to Build $30 Billion Memory Fab in China
Dylan McGrath, EETimes
1/20/2017 01:50 AM EST
SAN FRANCISCO—China’s state-controlled chip vendor Tsinghua Unigroup Ltd. announced plans to build a $30 billion memory chip in Nanjing, a city in eastern China.
Tsinghua, which has acquired several chip vendors and facilities over the past few years, is also building a $24 billion memory fab in the Chinese city of Wuhan, announced last March.
Tsinghua said it plans to build DRAM and 3D NAND flash at the Nanjing fab. The first phase of the project will cost about $10 billion and result in the production capacity to produce 100,000 wafers per month, the company said. No timetable was provided for the project.
In 2015, Tsingua made an unsuccessful bid to acquire U.S. memory chip vendor Micron Technology Inc. for $23 billion.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Foxconn Reportedly Readies Chip Fab in China
- CEO interview: Paul Wells of SureCore on low power memory and China
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
Latest News
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA
- Altera Introduces Next-Generation Agilex 9 Direct RF-Series SoC FPGA to Power the Future of High-Performance RF Systems