Tality Achieves Latest Qualification for Bluetooth 1.1
Tality Achieves Latest Qualification for Bluetooth 1.1
SAN FRANCISCO--(BUSINESS WIRE)--Dec. 11, 2001--Tality Corporation today announced its Bluetooth baseband controller and lower protocol stack Intellectual Property (IP) has successfully completed the most current Bluetooth 1.1 qualification from the Bluetooth Special Interest Group (SIG). Tality's qualification to the newest test requirements guarantees customers a complete pre-certification of Tality's Bluetooth IP. Tality, the world's leading supplier of Bluetooth licenses, has already assisted a number of customers in Japan, Europe and the US, through the qualification process to accelerate the development of their Bluetooth applications.
"We believe the Bluetooth standard has reached a critical stage for the development of mass consumer applications," said Simon Jones, general manager of Tality's Bluetooth Business Group. "Therefore, it is important for us to qualify against the latest test requirements. The recent qualification of our suite of Bluetooth IP, coupled with our ongoing participation in the industry's UnPlugFest events, demonstrates our commitment to achieving full interoperability for our client's products."
Tality's Bluetooth Track Record
Tality's Bluetooth IP portfolio includes a baseband controller core with lower protocol stack, an upper protocol stack, an FPGA-based development platform, and a SoC integration platform. In addition, Tality has developed silicon-proven radio frequency (RF) transceiver architecture.
Tality has been a member of the Bluetooth Special Interest Group since its inception in 1998. It is one of only five adopter members invited by the promoters to join the Radio Working Group, which is chartered with making significant enhancements to the Bluetooth 1.x specification. In addition, Tality has been at the forefront of Bluetooth interoperability testing by establishing its open-access Bluetooth Product Interoperability Verification Facility. The Facility enables product designers to run Tality's pre-developed UnPlugFest test scripts enabling them to identify and de-bug interoperability problems during the design phase.
About Tality
Tality Corporation, a subsidiary of Cadence Design Systems, Inc. (NYSE: CDN - news), is the world's largest electronic product development outsourcing provider. Leading and emerging technology companies around the globe leverage Tality's engineering services and intellectual property for the design of complex electronic systems and integrated circuits. Tality is headquartered in San Jose, California. For more information about Tality, please visit us at www.tality.com
Tality is a trademark of Tality Corporation. Cadence is a registered trademark of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.
Contact:
Tality Corporation
Jim Douglas, 408/944-7955
jimd@tality.com
or
Cohn&Wolfe
Leslie Taschner, 415/477-4542
leslie_taschner@cohnwolfe.com
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related News
- Dolphin Integration sRAM compiler completes TSMC IP9000 Level 1 qualification at 85 nm Ultra Low Power process
- SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform
- Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
- GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA