Strategies for Addressing More Complex Custom Chip Design

By Abhishek Jadhav, EETimes | March 21, 2025

Unprecedented growth and demand for edge computing and high-performance computing (HPC) is creating new opportunities and significant challenges for custom chips. We spoke to Sondrel CEO Oliver Jones to discuss some of the approaches to addressing these needs.

Custom chip design is a multifaceted process involving many considerations, from power efficiency and performance trade-offs to manufacturing and packaging complexities. One of the primary challenges in this domain is managing power, performance and area (PPA) trade-offs.

Designers must carefully balance these factors to ensure that the final product meets the strict requirements of modern applications like AI at the edge or HPC workloads. Additionally, the process involves navigating geopolitical disruptions and supply chain constraints, which can delay production and increase costs.

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