European bank loans ST $470 million
Peter Clarke, EETimes
9/28/2010 11:05 AM EDT
LONDON – The European Investment Ban k (EIB) has signed a 350 million euro (about $470 million) loan contract with STMicroelectronics NV in support of the company's industrial and R&D concerning next-generation semiconductor circuits.
The EIB is the bank of the European Union. Its remit is to provide mainly long-term loans to support viable private or public investment projects that realise the objectives of EU integration, cohesion and development.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- 1st Silicon CEO Claudio G. Loddo Completes His Contract with the Company
- Ericsson, Ordina enter strategic alliance - Ordina Technical Automation BV signs contract on strategic alliance for Bluetooth middleware and application development
- SMIC entered into a US$285 million loan agreement with four Chinese banks
- Rheinmetall Defence contract RF Engines for complex Signal Processing Design
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools