Startup Looks to Put PAs on CMOS Express
Dylan McGrath, EETimes
7/8/2016 05:01 PM EDT
SAN FRANCISCO—After emerging from semi-stealth mode to announce the infusion of $35 million in April, ACCO Semiconductor Inc. is looking to take its CMOS-based RF power amplifier business to the next level.
The Sunnyvale, Calif.-based startup, which traces its roots back to 1994, believes it can cash in on the growing opportunity for RF front end chips for cell phones and Internet of Things (IoT) products by strapping power amplifiers (PAs) to the same economic engine that has propelled most other types of chips: complementary metal–oxide–semiconductor (CMOS) process technology.
PAs are required for communications in modern cell phones and many IoT-connected products. The vast majority are built using silicon germanium or gallium arsenide technology rather than CMOS. ACCO has since 2007 been developing a technology to enable PAs to be built using CMOS, which the firm believes will enable them to take advantage of CMOS integration, Moore’s Law and the growing market for smartphones and IoT devices.
To read the full article, click here
Related Semiconductor IP
- RDMA IP
- PCIe Controller
- USB Controller
- MTP (Multi-Time Programmable) IP
- OTP (One-Time Programmable) IP
Related News
- Startup looks to put price tags on IP cores
- NVIDIA Joins the Windows on Arm Ecosystem, Driving Arm-Based AI Notebook Penetration to 34.2% by 2029, Says TrendForce
- Startup Ricursive to Create an End-to-End AI Model for Chip Design
- Kandou AI Selects Baya Systems to Power Its Attack on the AI Memory Wall
Latest News
- Top 10 Global Fabless IC Design Houses Post 73% YoY Revenue Growth in 2Q26; AMD Breaks into Top Three
- Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
- TSMC August 2026 Revenue Report
- Qualitas Semiconductor Signs MIPI IP Integrated Solution Licensing Agreement with CoAsia SEMI
- Alliance for Open Media Members Showcase AV2 Ecosystem Developments at IBC 2026