Smartphone is next stop for PCI Express
Rick Merritt, EETimes
9/13/2012 1:03 PM EDT
SAN FRANCISCO -- PCI Express, the I/O backbone of PCs and servers, is getting a low-power extension that will take it into Ultrabooks, tablets and smartphones starting next year. The enhanced interconnect will draw two to four times less power while helping mobile devices link to high-performance peripherals such as 60-GHz wireless networking controllers and solid-state drives.
The PCI Special Interest Group expects to approve by the end of the year a new version of its low level software for PCIe 3.0. The code will run on the M-PHY physical layer chips defined by the MIPI Alliance that creates handset interfaces.
To read the full article, click here
Related Semiconductor IP
- PCI Express Verification IP
- Scalable Switch Intel® FPGA IP for PCI Express
- Configurable PCI Express 4.0 Link Controller
- PCI Express Gen 1/2/3/4 Phy
- PCI Express Gen 1/2/3/4 Phy
Related News
- Mobiveil Teams With Semtech to Provide SoC Designers a Verified PCI Express(R) 3.0 Controller and PCI Express 3.0 PHY IP Solution
- Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process
- PLDA and Avery Design Systems Cooperate on PCI Express
- UHD Video Processing and PCI Express DMA IP-cores for real world applications
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools