Signal Edge Solutions Joins AMD Embedded Partner Program
Baltimore, Maryland, September 16, 2025 – Signal Edge Solutions, a leading provider of cutting-edge simulation, modeling, and measurement solutions, is pleased to announce that it is now a member of the AMD Embedded Partner Program.
The AMD Partner Network is designed to connect AMD customers with industry experts and service providers who can provide support and solutions to help them integrate AMD high performance and adaptive computing technologies into their products. As a member of the AMD Embedded Partner Program, Signal Edge Solutions joins the ranks of other prestigious companies including Analog Devices, Cadence, Keysight, Samtec, and Texas Instruments at the leading edge of design and development.
“This partnership reflects our commitment to providing our customers with the highest levels of quality and performance,” says Benjamin Dannan, the CEO and Chief Technologist of Signal Edge Solutions. “We look forward to working with AMD to offer their customers hands-on support to optimize and advance their product designs.”
Signal Edge Solutions brings cutting-edge expertise and a streamlined approach to help their customers tackle the most complex challenges of modern electronics design. Their end-to-end SI/PI simulation modeling of complex ASICs and FPGA designs provides clear, actionable insights, helping their customers to make informed decisions and avoid costly redesigns. Joining the AMD Embedded Partner Program will provide Signal Edge Solutions with increased opportunity to help AMD customers design, integrate, and model AMD adaptive computing solutions into their products.
About Signal Edge Solutions
Signal Edge Solutions was founded on the belief that there is a significant gap in the signal integrity and power integrity (SI/PI) field, particularly as the industry rapidly advances towards an AI-connected world. We are actively addressing this gap by providing highly advanced services and products that focus on high-speed measurement, measurement-based modeling, and electromagnetic (EM) modeling services tailored to ASIC, package, and printed circuit board (PCB) design. Our expertise ensures reliable performance in the complex ecosystems powering artificial intelligence and other cutting-edge applications. In addition to these, we offer specialized engineering consulting services, which include ASIC package design, chiplet package design, and end-to-end SI/PI simulation modeling of complex ASICs and FPGA designs, all critical for the demanding requirements of next-generation AI and data-driven technologies.
Related Semiconductor IP
- AXI to UCIe FDI Interface IP
- 45SPCLO UCIe-Class 1-32Gbps Low Power Receiver IP (NRZ)
- 45SPCLO UCIe-Class 1-32Gbps Low Power Transmitter IP (NRZ)
- Peripheral Sensor Interface (PSI5) Host Controller
- Link Acceleration Unit
Related News
- InPsytech Joins Samsung SAFE™ IP Partner Program for Excellence in ONFI and UCIe IP Solutions
- Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
- Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI
Latest News
- StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
- ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’