SEMIFIVE and SAPIEN Semiconductors Sign MOU to Develop Next-Generation Micro-display ‘CMOS Backplane’ Technology
- Accelerating commercialization by combining SEMIFIVE’s AI SoC platform with SAPIEN’s micro-LED display driver design expertise
- Strengthening the micro-display value chain through comprehensive collaboration from design to verification
- Expanding into the AI wearable market, including smart glasses and XR·AR devices
SEOUL, South Korea, January 26, 2025 — SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) design solutions, announced today that it has signed a strategic MOU with SAPIEN Semiconductors, a company specializing in advanced micro-LED display driver ASICs.
SEMIFIVE and SAPIEN Semiconductors will advance the design and technical evaluation of CMOS backplane technology, which is a core component of micro-displays. This partnership covers both technology and business aspects, including design verification and simulation to enhance technical maturity, technical guidance on Micro-LED Display Driver IC (DDI) implementation, and joint strategies for global market expansion.
“By combining SAPIEN Semiconductors’ expertise in micro-display driver design with SEMIFIVE’s custom ASIC capabilities, we will optimize the next-era display value chain and drastically reduce time-to-market,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “Through this synergy, we aim to redefine standards in the wearable market and jointly secure a dominant position in the global display industry.”
This strategic agreement comes at a pivotal moment, as global Big Tech companies identify AI smart glasses as the “next smartphone” and accelerate investments in the AI wearable market. With rising demand for micro-displays that provide ultra-high resolution, low power consumption, and compact form factors, the two companies aim to deliver optimized solutions by integrating their expertise to lead this growing market.
SEMIFIVE will drive overall chip development through its advanced AI SoC design platform and turnkey development capabilities, covering the entire process from design to mass production. SAPIEN Semiconductors will provide its proprietary technology and specialized expertise in micro-LED display driver design to develop optimized CMOS backplanes. By leveraging their complementary strengths, they plan to quickly meet market demands and accelerate the commercialization of cutting-edge technologies.
“By combining SAPIEN Semiconductors’ expertise in micro-display driver design with SEMIFIVE’s custom ASIC capabilities, we will optimize the next-era display value chain and drastically reduce time-to-market,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “Through this synergy, we aim to redefine standards in the wearable market and jointly secure a dominant position in the global display industry.”
“As the commercialization of AI wearables accelerates worldwide, this strategic partnership with SEMIFIVE is a key driver for staying ahead of market needs,” said Myunghee Lee, CEO of SAPIEN Semiconductors. “We are committed to establishing a solid technical edge in the future display market by successfully delivering differentiated CMOS backplane solutions.”
Learn more about SEMIFIVE
SEMIFIVE is the pioneer of platform-based SoC design, working with customers to implement innovative ideas into custom silicon in the most efficient way. Our SoC platforms offer a powerful springboard for new chip designs, and leverage configurable domain-specific architectures and pre-validated key IP pools. We offer comprehensive spec-to-system capabilities with end-to-end solutions so that custom SoCs can be realized faster, with reduced cost and risks for key applications such as data center or AI-enabled IoT. With a strong partnership with Samsung Foundry as a leading SAFETM DSP partner, as well as the larger ecosystem, SEMIFIVE provides a one-stop shop solution for any SoC design needs.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Sonics boosts silicon backplane IP network
- Rambus Announces the First 6.4 Gbps Backplane Serial Link Cell
- Lattice Semiconductor Announces World's First 2.7 Gigabit SONET Backplane Field Programmable System-on-a-Chip
- Rambus Announces Industry's First 10 Gbps Backplane Serial Link Solution
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles