GSA Reports All Semiconductor Company Segments Garnered Funding in August 2011
September 21, 2011 -- GSA Releases August Statistics from its Global Semiconductor Funding, IPO and M&A Update, including:
- In August, six semiconductor companies raised $65.3 million, down 20.0% from the $81.6 million raised in July 2011. August’s funding total decreased year-over-year (YoY) at a rate of 17.3%.
- In August, all company segments garnered funding.
- For the third consecutive month, zero semiconductor companies priced. August saw only one semiconductor company file for an initial public offering -- M/A-COM Technology Solutions Holdings, Inc.
- When looking at the closing stock prices posted on August 31 for those companies that priced in 2011, with the exception of Ingenic Semiconductor, zero companies posted a higher stock price than their offer price.
- In August, the number of semiconductor mergers and acquisitions (M&As) announced (i.e., M&As of entire fabless, IDM and semiconductor supplier companies, not sectors/product lines or foundry facilities) decreased by eight MoM and three YoY.
When: Now available at http://www.gsaglobal.org/publications/fundings/index.asp
About GSA
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org
Related Semiconductor IP
- UALink PHY + Controller
- General Purpose Low-Dropout (LDO) - TSMC
- Camera Post-Processing IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
Related News
- TSMC August 2011 Sales Report
- Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners
- Xiphera receives Business Finland's Young Innovative Company funding
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Latest News
- «Made in Germany» Security Chip Serves as a Root of Trust for Connected Devices
- GUC Monthly Sales Report – June 2026
- Ceva Wins Landmark AI Licensing Deal with Major U.S. Software and AI Platform Company
- UMC Reports Sales for June 2026
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications