Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology
World's First consumer product with the new 10nm FinFET process expected to be introduced in early 2017
SEOUL, South Korea -- October 16, 2016 -- Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.
Following the successful mass production of the industry’s first FinFET mobile application processor (AP) in January, 2015, Samsung extends its leadership in delivering leading-edge process technology to the mass market with the latest offering.
“The industry’s first mass production of 10nm FinFET technology demonstrates our leadership in advanced process technology,” said Jong Shik Yoon, Executive Vice President, Head of Foundry Business at Samsung Electronics. “We will continue our efforts to innovate scaling technologies and provide differentiated total solutions to our customers.”
Samsung’s new 10nm FinFET process (10LPE) adopts an advanced 3D transistor structure with additional enhancements in both process technology and design enablement compared to its 14nm predecessor, allowing up to 30-percent increase in area efficiency with 27-percent higher performance or 40-percent lower power consumption. In order to overcome scaling limitations, cutting edge techniques such as triple-patterning to allow bi-directional routing are also used to retain design and routing flexibility from prior nodes.
Following the introduction of Samsung’s first-generation 10nm process (10LPE), its second generation process (10LPP) with performance boost is targeted for mass production in the second half of 2017. The company plans to continue its leadership with a variety of derivative processes to meet the needs of a wide range of applications.
Through close collaboration with customers and partners, Samsung also aims to cultivate a robust 10nm foundry ecosystem that includes reference flow verification, IPs and libraries.
Production level process design kits (PDK) and IP design kits are currently available for design starts.
SoCs with 10nm process technology will be used in digital devices launching early next year and are expected to become more widely available throughout 2017.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co. Ltd. inspires the world and shapes the future with transformative ideas and technologies, opening new possibilities for people everywhere through relentless innovation and discovery. For the latest news, please visit the Samsung Newsroom at news.samsung.com.
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related News
- Synopsys' Custom Compiler Certified for TSMC 10-nm and 7-nm FinFET Process Nodes
- Silicon Creations Taps Silvaco's Custom Design Flow for 10nm FinFET Designs
- eMemory's NeoFuse IP Verified in TSMC 10nm FinFET Process
- Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA