SambaNova CEO: Pre- to Post-AI Transition Will Be "Bigger Than the Internet"
By Sally Ward-Foxton, EETimes (June 10, 2021)
Data center AI chip and system startup SambaNova hit the headlines recently with an enormous Series D funding round of $676 million, pushing the 100-person company’s valuation above $5 billion, a staggering amount for a young company which only emerged from stealth at the end of 2020. The company is now one of the best-funded AI chip companies in the world, with more than $1.1 billion raised. EE Times sat down with SambaNova CEO Rodrigo Liang to discuss the company’s strategy and roadmap.
Firstly, why are SambaNova and its competitors in the data center AI space attracting such huge amounts of funding? Is it required to get the product right, does it take this amount of resources to go up against the incumbents, or does it simply reflect investors’ view of the market opportunity?
“As much as we know that semiconductor design is a very capital-intensive venture, a billion dollars in cash for a small company is a lot,” Liang said. “I think it reflects what people see as the market opportunity.”
The market for data center AI hardware and software systems is growing rapidly as demand increases for AI-specific processing power.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time
- CEVA, Inc. Announces CEO Transition Plan
- Sondrel announces CEO transition to lead next phase of growth
- Silvaco Announces CEO Transition
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release