Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
Plano, Texas, USA -- September 24, 2024 -- Siemens Digital Industries Software today announced that Japan-based Preferred Networks Inc. (PFN), a leader in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro™ software to optimize the power efficiency of its next-generation AI processors.
Founded in 2014, PFN is known for cutting-edge research and development in areas like machine learning, robotics and autonomous systems. The company collaborates with innovators across a range of industries, including manufacturing, healthcare and transportation, to integrate AI solutions into their operations.
PFN used the software’s broad array of power-saving register transfer-level (RTL) features to develop a new generation of AI integrated circuits (ICs) that deliver exceptional performance and low power consumption. Siemens’ PowerPro software also enabled PFN to rapidly conduct accurate power estimation for both RTL and gate-level designs, allowing its design teams to quickly find and address power issues during RTL development – helping to dramatically enhance the power efficiency of its next generation AI semiconductor designs.
“Siemens’ PowerPro software enables us to design low-power and energy efficient AI chips that meet the stringent standards that our customers demand,” said Junichiro Makino, chief technology officer for Computer Architecture at PFN, and Professor-at-Large at Kobe University. “This advanced technology allows us to take our project to the next level, while helping our customers develop compelling and highly differentiated end-products based on our next-generation AI semiconductors.”
PowerPro’s automatic optimization is the only truly capable, production proven, automatic low-power RTL optimization solution available in the market today. Based on deep sequential analysis technology, it rapidly identifies the most effective clock and memory gating pathways for the design, which can dramatically boost overall power efficiency.
“Siemens is pleased that PFN has adopted our PowerPro software to enhance the power efficiency of their next-generation AI processor designs,” said Ankur Gupta, senior vice president and general manager, Digital Design Creation Platform, Siemens Digital Industries Software. “PowerPro improves the power efficiency of next-generation designs and we look forward to the innovation that PFN’s next generation AI processors will unleash.”
To learn more about Siemens’ PowerPro software visit: https://eda.sw.siemens.com/en-US/ic/powerpro/
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Siemens accelerates integrated circuit design and verification with agentic AI in Questa One
- Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
- Siemens collaborates with TSMC to advance AI for semiconductor design
- Siemens to bring advanced timing constraint capabilities to EDA design flow with Excellicon acquisition
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release