Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
By Semiconductor Business News
February 26, 2002 (9:02 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020226S0005
EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. and STMicroelectronics today announced an agreement to jointly develop platform products for set-top boxes and digital television sets. The alliance will apply Philips' software for multimedia home platforms and STMicroelectronics' single-chip digital decoder to provide new turnkey solutions. Philips here and STMicroelectronics based near Geneva said the turnkey solutions will help to dramatically reduce the development and production time for new set-top boxed and integrated digital TV sets. Both companies will develop and market pre-integrated solutions of the Philips MHP 1.0.x Software Platform and ST's Omega series of digital set-top box decoder chips. In Europe and Asia, the new DVB-MHP open standard for interactive digital television is providing a platform for software and content development, said Philips managers. Philips Softworks, a business unit of Philips Digital Net works, has developed and implemented an MHP 1.0.1-compliant software 'stack' offering full interactive digital television functionality. "These software bundles dramatically cut product development and production times for set-top box and TV manufacturers looking to enter the digital market in a fast and flexible way," said Frank Bosveld, general manager of Philips Softworks. Reference systems combining hardware and software for integrated operation will make use of technologies from both ST and Philips. Under the new agreement, ST will work with Philips to jointly market MHP Reference Systems based on the Omega series of set-top box decoders. Demonstration models are scheduled to be available in early 2002 with a complete reference system in product quality following in the middle of this year.
Related Semiconductor IP
- Mesochronous Bridge for PCIe/CXL
- AI-native GPU
- OpenGMSL Verification IP
- OpenGMSL Leaf IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
Related News
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research
- Amino will Port Advanced Software Stack For IPTV Set-Top Boxes on Philips' Semiconductors Reference Design
- Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
Latest News
- SignatureIP Unveils MesoLink, a Mesochronous Bridge for PCIe/CXL Validation
- ICTK Partners with Jiran Security to Drive Post-Quantum Cryptography (PQC) Migration
- S2C Named Andes Technology’s 2026 Partner of the Year
- BrainChip Launches AKD1500 PCIe Card For Edge AI Evaluation Everywhere
- TDK-Micronas adopts Aniah’s AI-powered OneCheck® platform to advance automotive semiconductor development