NXP CEO: 'Security, IoT, Cars' Drove Freescale Deal
Clemmer on overlapping businesses
Junko Yoshida
3/3/2015 03:47 PM EST
BARCELONA — One Freescale executive who appears to have secured his spot in the soon-to-be merged NXP is Geoff Lees, senior vice president and general manager, responsible for Freescale’s microcontroller business.
Reached by EE Times Monday, Lees stayed mum, except to say that he used to work at NXP, before joining Freescale three years ago.
In a one-on-one interview Tuesday (March 3) with EE Times, Rick Clemmer, CEO of NXP, said, “Geoff will be coming home to us. He’s a good guy. Glad to have him back.”
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- NXP and Freescale Announce $40 Billion Merger
- NXP, Freescale: Bigger Not Better
- NXP + Freescale Merger Set To Create Leading Vendor of Automotive Semiconductors in 2015; Renesas Was The Largest Vendor in 2014
- Freescale Reveals NXP Mega Merger Details
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release