National to use SiidTech's Silicon Fingerprinting to boost chip yields
National to use SiidTech's Silicon Fingerprinting to boost chip yields
By Mark LaPedus, Semiconductor Business News
August 27, 2001 (9:20 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010827S0006
SANTA CLARA, Calif. -- National Semiconductor Corp. here today announced that it has become the first company to license SiidTech Inc.'s chip-level tracking technology. Under the terms of the deal, National will license SiidTech's Silicon Fingerprinting technology. Dubbed "ICID," SiidTech's technology electronically tracks CMOS integrated circuits and intellectual property cores in ICs by using measurements of dopant profiles in CMOS transistors to identify each chip. Introduced last year, the technology help reduce waste in chip manufacturing, boost yields, and prevents fraud in the marketplace, according to Hillsboro, Ore.-based SiidTech (see Feb. 7, 2000, story). National plans to use the technology to enhance its manufacturing and test yields, said Mohan Yegnashankaran, vice president of product development at the Santa Clara chip company. "SiidTech worked with us to incorporate ICID into our existing design/manufacturing database and data flow infrastructure," Yegnashankaran said. "National plans to start using ICID on one manufacturing process and gradually increase to several more in the next year or so." "The package to die-on-wafer correlation afforded by the SiidTech product should help raise our chip yields and greatly enhance our ability for rapid fault isolation," he added. SiidTech's technology is optimized for National's 0.18-micron process technology," said Steve Sapiro, vice president of marketing at SiidTech. "We also have 0.15-micron in design," he said in an interview with SBN. The deal with National is a major boost for Siidtech. The Hillsboro-based company is also pursuing alliances with other chip makers and systems manufacturers as well. The company's technology is an attractive solution, because of its flexibility, low cost, and other reasons. "The technology will run on any CMOS process," Sapiro added.
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related News
- LogicVision And SiidTech Form Strategic Alliance to Explore Silicon Fingerprinting Usage and Embedded Test
- Foundries Use Small Feature Sizes to Boost Revenue per Wafer
- Neurons cast in silicon: AI chip SENNA accelerates spiking neural networks
- EnSilica: Ongoing Investment in Space Industry Fuelling Silicon Chip Demand
Latest News
- Imec unlocks fourfold UWB range extension using world-first narrowband receiver chip compliant with IEEE 802.15.4ab standard
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology