Will More-than-Moore Take Off in China?
By Mo Dakang
EETimes (August 20, 2019)
Most semiconductor enterprises in China are focusing on their survival and profit. It's impractical to force them to keep following Moore's Law or trying the IDM model for memory volume production.
Professor Bo Zhang of the University of Electronic Science and Technology of China recently suggested that "More than Moore" will become an important opportunity for the Chinese semiconductor industry. Professor Zhang's unique insights on this topic are now attracting interest from the industry.
The “More-than-Moore” concept seems new. It's not. Professor Zhang said that it is, actually, nothing more than one of the three directions of Moore's Law.
Professor Zhang refers to the “More-than-Moore process” as “non-size dependent.” It describes the improvement of the value or performance of the device, not by the size reduction, but by the increase of functions.
Moore's Law has governed the semiconductor industry for more than 50 years, shrinking the size of transistors and enlarging the diameters of wafers, with the former playing a critical role.
But Moore’s Law has its limitations. It worked in an era when increasing the density of transistors reduced costs. Moore’s Law, however, failed to predict the greater power consumption at the cost of improved transistor performance. This has prompted the industry in recent years to look at other dimensions of the Law – namely, “non-size dependent" processes.
Why More-than-Moore now?
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- European report considers 450-mm More-than-Moore fab
- More-than-Moore Will Lead, Argues GloFo's Wijburg
- Shanghai Seeks 'More-than-Moore' in Silicon Valley
- Why RISC-V Lags in China
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release