MIPS, GlobalFoundries Bet on Physical AI
By Aalyia Shaukat , EE Times | March 3, 2026

MIPS has made some waves in the embedded processor IP community, especially with its recent acquisition of Synopsys’s ARC processor IP business. The company has made a major comeback since filing for bankruptcy in 2020 and emerging from the downturn, shifting its focus from Microprocessor without Interlocked Pipelined Stages (MIPS) to RISC-V architecture. The company heralded the MIPS instruction set with massive success, helping accelerate it’s physical AI roadmap. “We’ve got 200 million SoCs today in autonomous vehicles with long-standing customers,” James Prior, head of marketing at MIPS, told EE Times at CES 2026.
The move to RISC-V
Since its foundational MIPS architecture was introduced in 1985 via the R2000/R3000, MIPS has introduced seven versions of MIPS cores, and since 2022, the eighth generation has been RISC-V. “Our eighth generation of products is our first generation of RISC-V,” Prior said. He referenced the company’s long-standing customer Mobileye, which has already released six generations of its EyeQ product line and recently announced EyeQ7 using the new MIPS RISC-V technology. “EyeQ6 is used in 1,200 different car models across 50 different global OEMs. That’s 75% of ADAS in the actual market.”
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- MIPS S8200 Delivers Software-First RISC-V NPU To Enable Physical AI at the Autonomous Edge
- GlobalFoundries to Acquire Synopsys’ Processor IP Solutions Business, Expanding Capabilities to Accelerate Physical AI Applications
- MIPS and INOVA Collaborate to put Physical AI into the palm of Robotic hands with new Reference Platform
- Arteris and MIPS Partner to Accelerate Development for Physical AI Platforms
Latest News
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release
- IC Manage Advances GDP-AI for Custom IC Design with Virtuoso