MegaChips Deploys Omni Design's Silicon-Validated Data Converters
6 Gsps ADC and 7 Gsps DAC used in Automotive Ethernet SoC
SAN JOSE, Calif., – Oct 19, 2021 – Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced that MegaChips Corporation is deploying the 12-bit 6 Gsps analog-to-digital (ADC) and 12-bit 7 Gsps digital-to-analog (DAC) converters in its next-generation automotive SoCs.
“We adopted Omni Design’s Lepton family of data converters to accelerate development of our SoCs targeted to the automotive and communications markets,” said Hisashi Kondo, Senior General Manager, ASSP Business at MegaChips Corporation. “MegaChips has a long history of partnering with Omni Design in ADCs and DACs. Using these high-performance IP cores in our products enables us to deliver market leading products to our customers in 2022.”
“Omni Design has supplied high performance data converters to MegaChips in multiple process nodes,” said Dr. Kush Gulati, President and CEO of Omni Design Technologies. “We are excited to see these silicon-validated ADC and DAC IP cores being deployed successfully by MegaChips in their automotive ethernet SoC.”
For more information about Omni Design’s IP portfolio, please visit www.omnidesigntech.com.
About Omni Design Technologies
Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores in advanced process technologies that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, automotive, imaging, sensors, and the internet-of-things (IoT). Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaborating with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins, Colorado, Billerica, Massachusetts and Bangalore, India. For more information, visit www.omnidesigntech.com.
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Metanoia Adopts Omni Design's Multi Giga Sample Data Converters in 5G products
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters
- Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
- Omni Design Technologies Secures over $35 Million in Series A Funding to Advance Its Leadership in Wideband Signal Processing™ for the AI Data Revolution
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA