Japan's Oki licenses DSP technology from DSP Group
Japan's Oki licenses DSP technology from DSP Group
By Semiconductor Business News
February 20, 2001 (2:47 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010220S0063
SANTA CLARA, Calif. -- DSP Group Inc. here today (Feb. 20) announced it has licensed its digital signal processor (DSP) technology to Japan's Oki Electric Industry Co. Ltd. Under the terms, Oki has licensed the DSP Group's Teak DSP Core product line, which is designed for use in audio and wireless applications. Oki has also licensed other DSP cores from DSP Group, including its SmartCores, OakDSPCore, and TeakLite product lines. The Teak DSP Core is a high-performance, 16-bit, fixed-point DSP core. It uses a dual multiply-accumulate architecture that enables a peak performance of 420 million of instructions per second.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
- Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
- Metanoia Licenses Cadence Tensilica ConnX 230 DSP for New SDR Platform
- BaySand to Acquire FalconX Accelerator, to Enhance Its Application Configurable Platform Offering with Configurable DSP Capabilities
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release