Intel Halts Products, Slows Roadmap in Years-Long Turnaround
By Alan Patterson, EETimes (February 3, 2025)
Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that will take years, according to analysts surveyed by EE Times.
The company’s new top management, Michelle Holthaus and David Zinsner, are more realistic on challenges from competitors like AMD in processors and TSMC in the foundry business, according to C.J. Muse, Senior Managing Director of Cantor Fitzgerald.
“Intel’s new co-CEOs hosted their first conference call with commentary balanced and realistic, highlighting the meaningful challenges ahead at Intel and the view that there are no quick fixes, unfortunately,” Muse said in a report provided to EE Times.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- Artisan Components Furthers Library Roadmap with TSMC 0.13-Micron Agreement
- 1999 roadmap targets new 'performance SoC' category
- Intel and ARM Finalize Architecture Roadmap Licensing Agreement
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers