Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
By Alan Patterson, EETimes (February 21, 2024)
“I don’t see anything that limits us, from a capacity point of view, with the deals we’re pursuing right now for advanced packaging,” Pann said. He and Intel CEO Pat Gelsinger decided to equip new packaging facilities a couple years ago when the PC and server markets were much bigger.
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