Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
By Alan Patterson, EETimes (February 21, 2024)
“I don’t see anything that limits us, from a capacity point of view, with the deals we’re pursuing right now for advanced packaging,” Pann said. He and Intel CEO Pat Gelsinger decided to equip new packaging facilities a couple years ago when the PC and server markets were much bigger.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
- CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
- Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product
Latest News
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA
- Altera Introduces Next-Generation Agilex 9 Direct RF-Series SoC FPGA to Power the Future of High-Performance RF Systems