Innocor announces an OTN G.709 option module, a new multi-rate SONET/SDH module, as well as the industry’s first user configurable optics module
Atlanta, Georgia, USA – March 25, 2003 - Innocor, a leading provider of broadband transmission test equipment and semiconductor intellectual property for telecommunications today announced several new products for it’s scaleable multi-port test platform.
“We are very proud of the substantial increase to our test portfolio that is being introduced at OFC this year” said Randy Gill, President of Innocor. “In direct response to the requests of our customers, we are introducing our OTN G.709 option module, a new multi-rate SONET/SDH module, as well as the industry’s first user configurable optics module.”
Innocor’s OTN G.709 option module is a full-featured configurable option for the OC-192 (STM-64) interface test card. The multi-rate module provides the ability to select between the integrated OC-3 (STM-1), OC-12 (STM-4), OC-48 (STM-16) and GbE interface SFP equipped ports. The user configurable optics module permits users to install, configure and software control the optical components, such as attenuators and switches, etc., which are normally required to complete a test station. All of the Innocor multi-port test platform modules can be hot-inserted so no testing downtime is required to upgrade a system with these new capabilities.
About Innocor Ltd.
Established in 1995, Innocor™ designs and manufactures industry-leading test equipment, development systems and IP core technology for telecom applications.
Products include:
- Test equipment for SONET /SDH, ATM and Packet Over SONET (POS), MPLS, 10GbE WAN / LAN, UTOPIA, POS-PHY with interfaces including UTOPIA L1/L2, POS-PHY L2, T1, T3, OC-3 (STM-1), OC-12 (STM-4), OC-48 (STM-16), OC-192 (STM-64), 10GbE WAN/LAN, 1GE, OTU2 G.709, and a User Configurable Optics module
- Development platforms for LAN - WAN access protocols or applications development and integration
- Pre-engineered silicon-ready cores for Systems-on-a- Programmable-Chip (SOPC)
- Custom design, engineering and support services
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- PRO DESIGN Unveils Affordable Virtex 7 Based FPGA Module for Multi FPGA Prototyping
- RC Module announces new SD/HD H.264 Decoder SoC aimed at Russian DVB market
- Jennic launches IEEE802.15.4 / ZigBee module range to accelerate wireless sensor product development
- PLDA announces contract with VMETRO - PCI Express & PCI-X IPs integrated with the SFM Quad Serial FPDP Module
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers