India's Wipro expands IC-design services by striking foundry deal with UMC
India's Wipro expands IC-design services by striking foundry deal with UMC
By Semiconductor Business News
January 22, 2002 (8:05 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020122S0052
BANGALORE, India -- India's Wipro Ltd. here today moved to expand its IC-design service offerings, announcing a deal with Taiwan's United Microelectronics Corp. Under the terms, Wipro will offer its IC-design customers with "easy access" to UMC's silicon foundry services, according to the Bangalore-based company. Wipro is the largest information technology (IT) provider in India. The deal will give Wipro a "one-stop shop" of chip services. Wipro's IC arm, Wipro Technologies, specializes in the development of ASIC and system-on-a-chip (SoC) designs. Its customers include Alcatel, Cisco, Hitachi, Intel, Sony, and Texas Instruments. "Wipro focuses on realizing products for our customers in embedded, Internet, and telecom areas," said M. Divakaran, CEO of the Embedded and Internet Access Division at Wipro Technologies. "This alignment with UMC enables us toprovide turnkey ASIC/SoC solutions. With this agreement, customers can look to Wipro as a one-stop shop for their complete product development," he said.
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
- L&T Technology Services wins USD45 million EV deal from U.S. Auto Tier-1
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers