Huawei and Intel Collaborate on LTE TDD
Companies creating a China-based IOT lab to accelerate development of the ecosystem
Beijing, China, April 27 , 2012 -- Intel Corporation and Huawei, a leading global information and communication technology (ICT) solutions provider, today announced a collaboration to advance the development of interoperability testing and deployment of LTE TDD solutions. The two companies will establish joint lab set-up based in China for IOT (Interoperability Test) and fast implementation of LTE TDD technology.
"Huawei has been committed to LTE TDD commercial deployment worldwide," said Deng Taihua, president LTE TDD & WiMAX &TDS wireless networks, Huawei. "We will continuously invest in LTE TDD research and deployment as well as the global expansion of LTE TDD networks. We are excited to partner with Intel to accelerate the development of our technology and provide our customers with leading LTE TDD solutions."
The collaboration will utilize Huawei's expertise in LTE TDD network infrastructure technologies and Intel’s innovative and cost-optimized mobile communication platforms to expedite the maturity and deployment of LTE TDD. By connecting directly to the Huawei’s infrastructure Intel will carry out end-to -end testing of its mobile platforms in a real life environment.
"Collaborative innovation is Intel’s strategy in China," said W.K Tan, VP of Intel IAG & Head of MCG, China. "The engagement with Huawei will take advantage of the two companies’ strengths and leading technologies. We are committed to working together with partners in China to build a healthy LTE TDD ecosystem within China and even beyond."
Related Semiconductor IP
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
- UCIe 3.x Controller IP
- Ethernet 800G PCS IP
- CHI to UCIe Bridge IP
Related News
- Sequans Unveils Next-Generation FDD and TDD LTE Chips and Global LTE Platforms
- Sequans and Huawei Collaborate to Advance LTE Broadcast Technology
- Intel and UMC Announce New Foundry Collaboration
- Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing
Latest News
- StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
- ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’