Hitachi, Silicon Wave team up to develop single-chip Bluetooth solutions
Hitachi, Silicon Wave team up to develop single-chip Bluetooth solutions
By Semiconductor Business News
May 30, 2001 (2:32 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010530S0072
TOKYO -- Hitachi Ltd. and Silicon Wave Inc. here announced that they will team up to develop a line of system-on-a-chip products for Bluetooth-enabled applications. As part of the agreement, Hitachi has licensed Silicon Wave's Bluetooth-enable baseband chip core, which meets the 1.1 standard of the Bluetooth specification. The Japanese company will integrate Silicon Wave's baseband core into its own H8S microcontroller line. The resulting product will be a single-chip baseband processor that measures 15- x 20-mm. The product will include flash or ROM memory with Silicon Wave's SiW1502 radio modem IC. "This agreement with Silicon Wave allows Hitachi to offer a complete two-chip Bluetooth solution," said Kazuo Minorikawa, senior group executive of Microcomputer Division at Hitachi.
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- GlobalFoundries and Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
- CEVA Leads the Bluetooth 5 IP Wave
- EnSilica: Ongoing Investment in Space Industry Fuelling Silicon Chip Demand
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools