Google Selects Rockchip for Modular Smartphone Processor
Peter Clarke, Electronics360
August 25, 2014
Internet giant Google has started a design effort with Chinese fabless chip company Rockchip to develop an application processor for the Project Ara modular mobile phone, according to a posting within the Google+ interest group section for Google's Advanced Technology and Projects.
Project Ara is the codename given by Google to a project to develop a customizable handset in which hardware can be swapped in and out, like Lego blocks. In this way users will be able to select the peripheral set, the camera, amount of RAM, battery size and so on and plug together a custom smartphone based on a universal development board. While the idea of customizable consumer smartphone is unlikely to compete in efficiency or optimization with products developed by IDMs and white box companies ,it could provide a cost efficient way of developing mobile systems for industrial, robotics, medical and automotive applications.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- MIPI UniPort-M Selected by Google for Modular Smartphone "Project Ara"
- Google's ATAP Group Selects Lattice FPGAs for its Project Ara Modular Smartphone Prototype
- eInfochips and Toshiba Unveil Development Kits to Accelerate Development of Google Project Ara Modular Smartphones
- INSIDE Secure DRM Fusion Adds Support for Google Widevine Modular DRM System
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release