FRAM license boosts Ramtron's revenue outlook
FRAM license boosts Ramtron's revenue outlook
By Jeanne Graham, EBN
October 4, 2001 (12:20 p.m. EST)
URL: http://www.eetimes.com/story/OEG20011004S0055
Ramtron International Corp. today said revenue expectations for the third quarter ended Sept. 30 are $7 million to $8 million, more than double its second quarter revenue of $3.4 million primarily due to a licensing and development fee from a recent agreement with Texas Instruments Inc. The company's cash balance as of Sept. 30 was expected to be about $8 million, mainly due to fees paid by TI for Ramtron's ferroelectric RAM (FRAM) technology. TI added the nonvolatile storage technology to its memory portfolio in August saying that FRAM would give it another high-speed embedded memory option. During the third quarter, Ramtron also sold about half of its holdings in Munich-based Infineon Technologies AG. Ramtron expects to take a one-time charge of $4.3 million in the quarter for a loss on the disposition of the stock and the decreased value of the remaining holdings due to Infineon's stock price declines. Ramtron, Colorado Springs, Colo., e xpects to release its financial results for the third quarter Nov. 1.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Ramtron and Revere Security Join Forces to Enable Secure and Energy Efficient F-RAM Semiconductor Devices
- TSMC Boosts Capital Expenditure Budget on Strong Outlook
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- NEC licenses Ramtron's FRAM, aims to speed integration in microcontrollers
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release