Jasper Releases New Formal Verification Proof Kits For LPDDR1, LPDDR2 and DDR3
MOUNTAIN VIEW, Calif. – Feb. 22, 2010 – Jasper Design Automation, provider of advanced formal technology solutions, today announced the availability of Proof Kits for LPDDR1 and LPDDR2, and DDR3 SDRAM. These Jasper Proof Kits are sets of properties, written in SystemVerilog, related to standard JEDEC interface protocols. Each Proof Kit includes a Formal Testplan providing detailed instructions on verifying DDR designs, plus properties for the protocol that the JasperGold® Verification System can prove against designs employing the standard. LPDDR solutions are experiencing high growth in mobile and embedded markets as demand for the low-power parts surges.
“These new LPDDR and DDR3 Proof Kits both speed verification for these high-demand memories, and ensure conformance with industry standards,” said Lawrence Loh, Jasper Vice President of Worldwide Applications Engineering. “They join our existing Proof Kits for SDR, DDR and DDR2, and we continue to actively follow and support new standards as they emerge.”
Availability
The new DDR Proof Kits are currently available as a chapter within Jasper Formal Testplanner, and provided at no additional charge to current licensees of Formal Testplanner.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Industry's Fastest Growing Standard for DDR-PHY Interface Specification Expands With LP-DDR2 and DDR3 Support
- Meet Axiomise's Ashish Darbari at DAC to Learn about Benefits of Formal Verification
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Siemens brings formal methods to high-level verification with C++ coverage closure and property checking
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles