First Silicon Solutions to Develop Instrumentation IP for Rockwell Collins
Rockwell Collins Selects First Silicon Solutions to Provide On-Chip Instrumentation IP and Tools for Avionics Hardware and Software Development
Portland, OR, May 15, 2002 -- First Silicon Solutions (FS2), a leading provider of silicon IP and custom development tools for SOC and SOPC designs, announced today that it has been selected to provide microprocessor instrumentation IP and tools for Rockwell Collins of Cedar Rapids, Iowa. The FS2 tools will be used by Rockwell Collins to develop and test software in existing high-reliability avionics system designs.
Rockwell Collins selection of FS2 will provide a long term upgrade path for its design teams as they transition products from existing traditional processors and tools to SOC based designs. FS2’s Navigator® OCI® (on-chip instrumentation) blocks will provide powerful debug features and logic that are typically inaccessible using traditional desktop tools.
“Rockwell Collins chose us for this job after careful evaluation of our capabilities and our ability to respond quickly, delivering state-of-the-art tools on-time and on-target to match the design team’s needs. By re-engineering the existing core design with the FS2 Navigator Suite of Tools, we will be able to leverage this custom IP to provide an easy upgrade path for Rockwell Collins more sophisticated designs well into the future.”
About Rockwell Collins (NYSE: COL)
Rockwell Collins is a global company providing aviation electronics for the world’s aircraft manufacturers and more than 400 airline customers, as well as a major share of the world’s military forces. The company maintains headquarters and manufacturing operations in the United States in addition to locations in Europe, Australia and Mexico.
About First Silicon Solutions, Inc. - www.fs2.com
FS2, located in Portland, Oregon, provides custom OCI enabled IP and development tools in-silicon for testing and debug of microprocessor-based hardware and software to major developers worldwide. FS2 helps silicon vendors and their customers develop and more effectively market their products, reducing their development cycles, and allowing them to focus on delivering all the potential of the system on silicon. For additional information, contact Chuck Swartley at (503) 292-6730 x103.
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Silicon Creations Celebrates 20 Years of Global Growth and Leadership in 2nm IP Solutions
- EADS Astrium, Hifn, Innovision Research, Magnum Semiconductor, Rockwell Collins, Universite de Cergy Pontoise, Vivante, and Wipro Join OCP-IP
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
- AMD Achieves First TSMC N2 Product Silicon Milestone
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA