High Customer Interest in FD-SOI, Globalfoundries Says
Dylan McGrath, EETimes
7/16/2015 00:00 AM EDT
SAN FRANCISCO --Customer interest is unusually high in Globalfoundries’ newly announced 22nm fully depleted silicon-on-insulator (FD-SOI) manufacturing platform, which could be in high-volume manufacturing by the middle of 2017, a company executive said at the Semicon West tradeshow here.
Customers were so eager to get to work on designs for the process technology that they persuaded Globalfoundries (Santa Clara, Calif.) to take the unusual step of devoting a small amount of space on process technology qualification vehicle (TQV) test chips to critical intellectual property from key customers, said Subramani Kengeri, vice president of global design solutions at Globalfoundries.
To read the full article, click here
Related Semiconductor IP
- SerDes Hard Macro-IP in GlobalFoundries 22FDX
- Automotive 12bit Sigma-Delta ADC - GlobalFoundries 22FDX
- 5V ESD Clamp in GlobalFoundries 180nm LPe
- 1x64 Bits OTP (One-Time Programmable) IP, GlobalFoundries 22nmFDX 0.8V/1.8V Process
- GLOBALFOUNDRIES 40nm LP 3.3V-2.5/1.1V Power Regulator
Related News
- CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line
- STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES
- FDSOI roadmap renames next node as 14-nm
- Altera eyes FDSOI process for FPGAs
Latest News
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
- Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
- RaiderChip’s Edge NPU reaches more than 50 Generative AI Models with the addition of Qwen3.8-27B