Scale FD-SOI to 7nm? Yes, We Can
By Anne-Françoise Pelé, EETimes Europe (November 16, 2023)
Why set the target at 10 nm when you can aim further?
During the consultative phase leading up to the Chips Act, the EU asked its three champions of microelectronics research—CEA-Leti, imec and Fraunhofer—how they might support the European challenge of doubling production by 2030, seeking their recommendations for a strategic roadmap. Their proposal included establishing a fully depleted silicon-on-insulator (FD-SOI) pilot line in Grenoble, France, to help scale FD-SOI process technology to 10 nm.
Why set the target at 10 nm when you can aim further? European Commissioner Thierry Breton raised the ante, proposing to scale FD-SOI down to 7 nm. Criticism was rife, but he persisted.
“If we set ourselves the ambition to get there, and to get there together at the European level, we will get there,” Breton said in September at the inauguration ceremony for Soitec’s SiC wafer fab in Bernin, near Grenoble.
To read the full article, click here
Related Semiconductor IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
- UCIe 2.x Controller IP
- SWI3S (SoundWire I3S Interface) Peripheral Controller Core IP
- OpenTitan-based RISC-V Secure Element
Related News
- FAMES makes its open call for 10nm, 7nm FD-SOI
- STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES
- FDSOI roadmap renames next node as 14-nm
- Altera eyes FDSOI process for FPGAs
Latest News
- Xiphera launches nQrux® Root of Trust with Post-Quantum Cryptography
- Skyechip Joins Rapidus Core Ecosystem, Bringing Advanced Silicon IP For AI and HPC to Japan's 2nm Platform
- GUC Monthly Sales Report – September 2026
- Rapidus Unveils “Rapidus CORE”, New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
- JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure