Faraday Unveils FlashKit™-22RRAM: an eNVM-based SoC Development Platform for IoT
Hsinchu, Taiwan -- June 10, 2025 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM、ReRAM) technology with a rich IP ecosystem and development-ready support, providing a cost-effective and power-efficient SoC solution for edge devices.
The FlashKit™-22RRAM platform integrates a full-featured RRAM subsystem with DWORD access, delivering comparable performance with SST eFlash. This solution minimizes extra-mask requirements, making it highly suitable for consumer-grade eNVM applications, such as AIoT, smart home, wearables, and portable devices. It is silicon proven and fully prepared to support customers' fast ramp-up to volume production on UMC’s 22ULP node.
FlashKit™-22RRAM supports embedded CPU options including ARM Cortex-M7 and VeeR EH1 RISC-V, and integrates a comprehensive set of integrated IPs such as USB 3.0 Type-C, GMAC, and PLL. A built-in RRAM controller with built-in self-test (BIST) ensures streamlined data access and high production reliability. In additional, embedded FPGA (eFPGA) block is included for enhanced design flexibility and enabling post-silicon logic change, ECO, or GPIO re-assignment.
“FlashKit™-22RRAM demonstrates Faraday’s continued commitment to delivering optimized platforms that reduce development effort and accelerate time-to-market,” said Flash Lin, COO of Faraday Technology. “Our customers now have a highly integrated and cost-efficient path to bring differentiated eNVM-based products to market quickly, with the flexibility to scale for future needs.”
About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is dedicated to the mission of benefiting humanity and upholding sustainable values in every IC it handles. The company offers a comprehensive range of ASIC solutions, including total 3DIC packaging, Neoverse CSS design, FPGA-Go-ASIC, and design implementation services. Furthermore, its extensive silicon IP portfolio encompasses a wide array of offerings, such as I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and SerDes. For further details, visit www.faraday-tech.com
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Faraday Highlights 40nm SONOS eNVM as NOR Flash Alternative for MCU Designs
- Faraday Launches Soteria! Security IP Subsystem for IoT ASIC
Latest News
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release
- IC Manage Advances GDP-AI for Custom IC Design with Virtuoso