ESilicon set to reap rewards of Asian gamble
Peter Clarke, EETimes
5/17/2012 10:49 AM EDT
LONDON – Design services provider eSilicon Inc. has helped several fabless chip companies and OEMs enter the market by managing their ASIC and SoC flows. It services include everything from IP selection and chip design to foundry and packaging.
Over the last two years, eSilicon has grown from about 150 staffers to about 500, including more than 300 employees based in Asia.
The shift to Asia, particularly China, comes after a decade in which eSilicon expanded beyond the North American market into Europe. The company now has two sites in Vietnam and offices in China, Taiwan, Singapore and South Korea.
To read the full article, click here
Related Semiconductor IP
- General Purpose Low-Dropout (LDO) - TSMC
- Camera Post-Processing IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
Related News
- Wireless Connectivity ICs to Surpass $8 Billion in 2011 with Broadcom, Qualcomm, CSR, Texas Instruments, and Many Others Set to Reap the Rewards
- IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
- Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing
- Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon
Latest News
- UMC Reports Sales for June 2026
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes