Ericsson’s BQTF ready for v1.2
September 15, 2003 - Ericsson’s Bluetooth Qualification Test Facility (BQTF) is ready to qualify any company’s product with the new Bluetooth version 1.2. Ericsson’s methods have been accepted by a Bluetooth Qualification Body (BQB).
Ericsson is now in the middle of testing their own v1.2 baseband, thus ensuring that the customers will be offered a method that is already proven.
In September, the Bluetooth SIG will be adopting the new 1.2 Bluetooth version with better voice quality, improved coexistence with other wireless technologies and faster connection time.
Bluetooth devices including the new version can be expected some time afterwards. But, before the new products reach the market, they must be qualified in one of the world’s 24 officially recognized BQTF’s, such as the full scope laboratory at Ericsson Technology Licensing.
Ericsson is now in the middle of testing their own v1.2 baseband, thus ensuring that the customers will be offered a method that is already proven.
In September, the Bluetooth SIG will be adopting the new 1.2 Bluetooth version with better voice quality, improved coexistence with other wireless technologies and faster connection time.
Bluetooth devices including the new version can be expected some time afterwards. But, before the new products reach the market, they must be qualified in one of the world’s 24 officially recognized BQTF’s, such as the full scope laboratory at Ericsson Technology Licensing.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- BQTF at Ericsson 1 of only 4 in World
- Ericsson boosts the Bluetooth market
- Virage supplies embedded memory technology to Ericsson Microelectronics
- Ericsson unveils new Bluetooth TM Intellectual Property
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release