eASIC rolls 90-nm structured ASIC line
Mark LaPedus, EE Times
(11/08/2006 9:54 PM EST)
SANTA CLARA, Calif. — FPGA vendors claim that they have conquered the ASIC for high-end designs. Some, however, believe that the battle is far from over. Seeking to displace FPGAs and other chip technologies in the marketplace, eASIC Corp. on Wednesday (Nov. 8) came out of its shell with a bang by unveiling a new 90-nm structured ASIC line. The company also disclosed a new foundry partnership with Fujitsu Ltd. and an EDA arrangement with Magma Design Automation Inc.
eASIC's 90-nm offering, dubbed Nextreme, is a family of six programmable structured ASICs, ranging in densities from 350,000 to 5 million gates — at performance levels up to 350-MHz. The Nextreme parts are quick turnaround devices that provide higher speeds but lower power levels than competitive FPGAs and ASICs, according to Ronnie Vasishta, chief executive for eASIC (Santa Clara, Calif.).
The fabless ASIC house also disclosed that it will no longer use STMicroelectronics Inc. (Geneva) as its main foundry. With its older-generation, 130-nm structured ASIC lines, eASIC had its parts built by STMicroelectronics on a foundry basis using a direct-write electron-beam manufacturing process.
(11/08/2006 9:54 PM EST)
SANTA CLARA, Calif. — FPGA vendors claim that they have conquered the ASIC for high-end designs. Some, however, believe that the battle is far from over. Seeking to displace FPGAs and other chip technologies in the marketplace, eASIC Corp. on Wednesday (Nov. 8) came out of its shell with a bang by unveiling a new 90-nm structured ASIC line. The company also disclosed a new foundry partnership with Fujitsu Ltd. and an EDA arrangement with Magma Design Automation Inc.
eASIC's 90-nm offering, dubbed Nextreme, is a family of six programmable structured ASICs, ranging in densities from 350,000 to 5 million gates — at performance levels up to 350-MHz. The Nextreme parts are quick turnaround devices that provide higher speeds but lower power levels than competitive FPGAs and ASICs, according to Ronnie Vasishta, chief executive for eASIC (Santa Clara, Calif.).
The fabless ASIC house also disclosed that it will no longer use STMicroelectronics Inc. (Geneva) as its main foundry. With its older-generation, 130-nm structured ASIC lines, eASIC had its parts built by STMicroelectronics on a foundry basis using a direct-write electron-beam manufacturing process.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Structured ASICs deserve serious attention at 90 nm
- eASIC Selects Fujitsu as Foundry Supplier for 90nm Structured ASIC
- eASIC Teams With CAST to Deliver ARM926EJ AMBA Compliant Peripherals for 90nm Nextreme(TM) Structured ASICs
- eASIC and MoreThanIP Partner to Deliver Tri-Mode (10/100/1000) Ethernet MAC Solutions for Nextreme Structured ASICs
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA