e2v strengthens semiconductors business with acquisition of Signal Processing Devices
February 3, 2016 -- e2v has strengthened its investment in high performance electronic solutions with the acquisitioni of Swedish signal processing design and development company, Signal Processing (SP) Devices.
SP Devices offers expertise in embedded error correction solutions for signal processing sub-systems and provides digitizers for demanding applications such as communications, radar and signal intelligence.
With this added expertise, e2v will offer solutions in error correction services for increased performance in time-interleaved Analog-to-Digital Converters (ADCs), linearized components, system and quadrature demodulators, and develop plans to release ADCs with enhanced performance specifications.
Richard Gibbs, President of e2v Semiconductors, said, “SP Devices presents excellent synergy with our existing data converter business; we continue to build on our signal processing chain solutions and these will now include digitizer boards, modules and even more service offerings.”
Tomas Wolf, CEO of SP Devices, commented, “We are excited to be a part of a company that values our heritage and continuously pushes the limits of what is possible in data acquisition solutions. In addition, for all our OEM customers this will provide additional organizational strength and capacity required for continued growth.”
Visit www.e2v.com/Semis for more information
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- e2v and SP Devices working together to deliver the ultimate in high-performance ADC solutions
- Achronix Now Shipping Industry's Highest Performance Speedster7t FPGA Devices
- Shanghai Jade Technologies license Hantro MPEG-4 SP video technology for their Digital Content Processor
- JMicron Technology Corp Develops Serial ATA II (3.0 Gpbs) PHY Core on UMC's 90nm G and 90nm SP Processes
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers