Dolphin Design unveils its innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs
Grenoble, France – May 4th, 2020 -- Dolphin Design, a leading provider in semiconductor IPs and design platforms, unveils their new System Platforms for Energy Efficient SoC Design – SPEED – which enable competitive SoCs to be designed with outstanding energy efficiency figures.
Energy efficiency is the key metric to optimize for next generation SoCs, to make devices smarter, smaller, faster, less power consuming, and able to operate at the very-edge. In essence, to do more with less energy.
To succeed in this new challenge, Fabless companies need to:
- Embed more functionalities in a single chip, deal with more data exchanges between the MCU and peripherals
- Deal with more complexity and advanced design techniques
- Ensure a secure and predictable design to minimize the Time-to-Market
- Benefit from customized solutions to ensure their competitivity
Dolphin Design can make dreams come true, addressing all these requirements quickly and easily with their turnkey SPEED platforms. Fabless companies can now master the Time-to-market, costs and risks of their chips, whatever the complexity.
The benefits of using SPEED platforms are immediate and valuable:
- Ultimate energy efficiency level: up to X1000
- Consistent, complete state-of-the-art IPs, available in all advanced technology nodes
- Advanced, verified SoC architecture, tailored to the applications’ requirements
- Seamless integration
- Scalable to any SoC complexity
- System-level utilities facilitating advanced low-power technique implementation
- Secured design cycle
- Early PPA assessment
- Standardized approach
- Pre-verified & pre-assessed solutions
Dolphin Design will unveil each of its 4 platforms in the coming weeks.
Each of them plays a key role in successfully bringing differentiated chips to the market: SPEED Power Management, SPEED Processing MCU, SPEED ML/AI Processing and SPEED Audio.
Stay tuned!
About Dolphin Design
Headquartered in France, Dolphin Design, previously known as Dolphin Integration, is a semiconductor company employing 160 people, including 140 highly qualified engineers.
Their IP clusters, available for various technological processes and optimized for the best Energy Efficiency, feed their tailored, scalable and modular Power Management and MCU subsystem platforms to deliver fast and secure ASICs, designed by, or for, their clients.
Alongside their clients, now exceeding 500 companies, they focus on human, inventive and long-term collaboration to enable them to bring products and devices, powered by innovative and accessible integrated circuits that minimize environmental impact, to the hands of billions of people every day. In consumer markets including IoT, AI and 5G, and in high reliability markets, they unleash SoC designer creativity to deliver differentiation.
Tell them your biggest dream. Dare the impossible. They tech it on.
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- AMI Announces a Shift-Left Initiative to De-Risk SoC Development for Arm Total Design in Collaboration with Arm and Synopsys
- DCD-SEMI Introduces eSPI Combo for Next-Generation Intel-Based Platforms
- Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
- Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA