Taiwan Passes South Korea to Become #1 in Total IC Wafer Fab Capacity
China now has over 50% more IC wafer fabrication capacity than Europe.
February 29, 2016 -- IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region, and by product type through 2020. Figure 1 breaks down the world’s installed monthly wafer production capacity by geographic region (or country) as of December 2015. Each regional number is the total installed monthly capacity of fabs located in that region regardless of the headquarters location for the companies that own the fabs. For example, the wafer capacity that South Korea-based Samsung has installed in the U.S. is counted in the North America capacity total, not in the South Korea capacity total. The ROW region consists primarily of Singapore, Israel, and Malaysia, but also includes countries/regions such as Russia, Belarus, Australia, and South America.

Figure 1
Some highlights of regional IC capacity by wafer size are shown below.
- As of Dec-2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country. Taiwan surpassed South Korea in 2015 to become the largest capacity holder after having passed Japan in 2011. China became a larger wafer capacity holder than Europe for the first time in 2010.
- For wafers 150mm in diameter and smaller, Japan was the top region in terms of the amount of capacity. The fabs running small size wafers tend to be older and typically process low-complexity, commodity type products or specialized devices.
- The capacity leaders for 200mm wafers were Taiwan and Japan. There have been many 200mm fabs closed over the past several years, but not in Taiwan and that resulted in the country becoming the largest source of 200mm capacity beginning in 2012. With Taiwan being home to most of the IC industry’s foundry capacity, the country’s share of 200mm capacity will likely rise further in the coming years.
- For 300mm wafers, South Korea was at the forefront, followed by Taiwan. Taiwan lost its position as the leading supplier of 300mm wafer capacity in 2013. That was in large part because ProMOS closed its large 300mm fabs, but it was also due to Samsung and SK Hynix continuing to expand their fabs in South Korea to support their high-volume DRAM and flash businesses.
Report Details: Global Wafer Capacity 2016-2020
IC Insights’ Global Wafer Capacity 2016-2020—Detailed Analysis and Forecast of the IC Industry’s Wafer Fab Capacity report assesses the IC industry’s capacity by wafer size, minimum process geometry, technology type, geographic region, and by device type through 2020. The report includes detailed profiles of the companies with the greatest fab capacity and gives comprehensive specifications on existing wafer fab facilities. Global Wafer Capacity 2016-2020 is priced at $4,290 for an individual user license. A multi-user worldwide corporate license is available for $6,990.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Microsemi Corporation Announces Superior Proposal to Acquire PMC-Sierra, Inc. for $11.50 Per Share With Intent to Close in December 2015
- GUC Monthly Sales Report - December 2015
- Samsung, TSMC Remain Tops in Available Wafer Fab Capacity
- UMC Reports Sales for December 2015
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles