Court nears verdict in Rambus vs. Hynix dispute
Spencer Chin, EE Times
(04/14/2006 5:27 PM EDT)
MANHASSET, N.Y. — A decision in the long and bitter patent lawsuit by Rambus Inc. against Hynix Semiconductor Inc. is expected to be rendered in the near future, perhaps as early as next week, according to sources close to the case.
A spokesman for Rambus (Los Altos, Calif.) said closing arguments in the case were aired in the U.S. District Court in San Jose Thursday (April 13). On Friday (April 14), the jury deliberated the case, but it did not render a verdict, according to the sources.
(04/14/2006 5:27 PM EDT)
MANHASSET, N.Y. — A decision in the long and bitter patent lawsuit by Rambus Inc. against Hynix Semiconductor Inc. is expected to be rendered in the near future, perhaps as early as next week, according to sources close to the case.
A spokesman for Rambus (Los Altos, Calif.) said closing arguments in the case were aired in the U.S. District Court in San Jose Thursday (April 13). On Friday (April 14), the jury deliberated the case, but it did not render a verdict, according to the sources.
To read the full article, click here
Related Semiconductor IP
- 100-10Gbps Ethernet MAC Controller
- SD Card Controller
- AXI4 Memory Controller IP Core
- AXI-Lite I2C Controller Core
- LVDS Transceiver IP core
Related News
- Law firm urges Supreme Court to decide Rambus vs. Infineon
- Court Enters Judgment That Monolithic Power Systems does not infringe O2 Micro Patent, Sets Aside $12 Million Jury Verdict, Awards $2.7 Million Plus Cost
- U.S. District Court For Northern California Conditionally Stays Hynix Trial Against Rambus
- U.S. District Court Issues Verdict on TSMC-UniRAM Case
Latest News
- BrainChip Launches AKD1500 Raspberry Pi 5 Kit: Giving Developers a Direct Path from Prototype to Production
- Cadence Joins the Genesis Mission Consortium to Advance AI-Driven Scientific Discovery and Microelectronics Innovation
- Onsemi picks up Codasip’s low-end RISC-V business for $14.5 million
- Semidynamics and Nokia Explore Collaboration to Strengthen Europe’s Sovereign AI Capabilities
- VeriSilicon Introduces GLTiny™ 3D GPU Programming Model for Ultra-Low-Power, Memory-Efficient Wearable Devices