Chinese startup foundry licenses Toshiba technology
Mike Clendenin, EE Times
(04/21/2006 6:24 AM EDT)
TAIPEI, Taiwan — Startup IC Spectrum Co. Ltd. has inked a deal with Toshiba Corp. for the transfer of 0.35-micron manufacturing process technology, so that it can begin foundry work. The process will be used in the company’s 200-mm wafer fab currently under construction in Kunshan, northwest of Shanghai.
The fab is due to come on line early in 2007. By the end of 2008, it expects to be in volume production for 0.35-, 0.25- and 0.18-micron technologies. The company is building a monthly capacity of 35,000 wafers with its initial $450 million investment, which is roughly split between private equity and VC and government and local bank support.
(04/21/2006 6:24 AM EDT)
TAIPEI, Taiwan — Startup IC Spectrum Co. Ltd. has inked a deal with Toshiba Corp. for the transfer of 0.35-micron manufacturing process technology, so that it can begin foundry work. The process will be used in the company’s 200-mm wafer fab currently under construction in Kunshan, northwest of Shanghai.
The fab is due to come on line early in 2007. By the end of 2008, it expects to be in volume production for 0.35-, 0.25- and 0.18-micron technologies. The company is building a monthly capacity of 35,000 wafers with its initial $450 million investment, which is roughly split between private equity and VC and government and local bank support.
To read the full article, click here
Related Semiconductor IP
- 100-10Gbps Ethernet MAC Controller
- SD Card Controller
- AXI4 Memory Controller IP Core
- AXI-Lite I2C Controller Core
- LVDS Transceiver IP core
Related News
- Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry
- Siemens EDA faces Chinese startup competitor
- Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs
- sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology
Latest News
- BrainChip Launches AKD1500 Raspberry Pi 5 Kit: Giving Developers a Direct Path from Prototype to Production
- Cadence Joins the Genesis Mission Consortium to Advance AI-Driven Scientific Discovery and Microelectronics Innovation
- Onsemi picks up Codasip’s low-end RISC-V business for $14.5 million
- Semidynamics and Nokia Explore Collaboration to Strengthen Europe’s Sovereign AI Capabilities
- VeriSilicon Introduces GLTiny™ 3D GPU Programming Model for Ultra-Low-Power, Memory-Efficient Wearable Devices