China Gears Up for Chip Dumping, Ex-DoC Official Says
By Alan Patterson, EETimes (September 26, 2023)
China’s government has used dumping to destroy overseas tech industries and take them over, former Department of Commerce (DoC) Under Secretary Nazak Nikakhtar told EE Times. The next targets are legacy chips and electric vehicle (EV) batteries, she predicted.
Nikakhtar began her career at DoC’s Bureau of Industry and Security (BIS) just after China joined the World Trade Organization (WTO) in 2001. She had just started seeing “systematic practices” by China that “hollowed out” U.S. tech industries. The October 2022 export control rules of the U.S. that are aimed at slowing China’s advance into leading-edge semiconductor nodes have failed, she said.
To read the full article, click here
Related Semiconductor IP
- AXI to UCIe FDI Interface IP
- 45SPCLO UCIe-Class 1-32Gbps Low Power Receiver IP (NRZ)
- 45SPCLO UCIe-Class 1-32Gbps Low Power Transmitter IP (NRZ)
- Peripheral Sensor Interface (PSI5) Host Controller
- Link Acceleration Unit
Related News
- MIPS lands up in China
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
- China Bets on Homegrown Chip Tech With RISC-V Push
Latest News
- StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
- ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’