China Gears Up for Chip Dumping, Ex-DoC Official Says
By Alan Patterson, EETimes (September 26, 2023)
China’s government has used dumping to destroy overseas tech industries and take them over, former Department of Commerce (DoC) Under Secretary Nazak Nikakhtar told EE Times. The next targets are legacy chips and electric vehicle (EV) batteries, she predicted.
Nikakhtar began her career at DoC’s Bureau of Industry and Security (BIS) just after China joined the World Trade Organization (WTO) in 2001. She had just started seeing “systematic practices” by China that “hollowed out” U.S. tech industries. The October 2022 export control rules of the U.S. that are aimed at slowing China’s advance into leading-edge semiconductor nodes have failed, she said.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Chip Interfaces Appoints Avant Technology as one of its distributors for Taiwan and China to Expand Business Opportunities in the IP Market
- MIPS lands up in China
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools