Updated: Sequans' WiMax chip drives Sprint Nextel's first 4G phone
Junko Yoshida, EETimes
(03/18/2010 10:55 AM EDT)
NEW YORK — It turns out that it's Sequans Communications, not Beceem, whose WiMax chip was designed into Sprint Nextel's first WiMax (4G) phone, scheduled to be unveiled next week during the CTIA wireless show.
By extension, it isn't MIPS Technologies, but CEVA, that received a big boost, since Sequans is using CEVA's DSP core in its WiMax/LTE baseband silicon.
Sequans' communication director Kimberly Tassin contacted EE Times to reveal that her company's baseband silicon is driving Sprint Nextel's first 4G phone.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Sequans Communications Uses VeriSilicon's ZSP Core for WiMAX/LTE Products
- Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
- PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers