Updated: Sequans' WiMax chip drives Sprint Nextel's first 4G phone
Junko Yoshida, EETimes
(03/18/2010 10:55 AM EDT)
By extension, it isn't MIPS Technologies, but CEVA, that received a big boost, since Sequans is using CEVA's DSP core in its WiMax/LTE baseband silicon.
Sequans' communication director Kimberly Tassin contacted EE Times to reveal that her company's baseband silicon is driving Sprint Nextel's first 4G phone.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Sequans Communications Uses VeriSilicon's ZSP Core for WiMAX/LTE Products
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
- Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
Latest News
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release
- IC Manage Advances GDP-AI for Custom IC Design with Virtuoso