Updated: Sequans' WiMax chip drives Sprint Nextel's first 4G phone
Junko Yoshida, EETimes
(03/18/2010 10:55 AM EDT)
By extension, it isn't MIPS Technologies, but CEVA, that received a big boost, since Sequans is using CEVA's DSP core in its WiMax/LTE baseband silicon.
Sequans' communication director Kimberly Tassin contacted EE Times to reveal that her company's baseband silicon is driving Sprint Nextel's first 4G phone.
To read the full article, click here
Related Semiconductor IP
- DSP-Based 112G SerDes
- XTAL oscillator in TSMC-7nm
- GPU
- V-by-One Verification IP
- AI model compression IP
Related News
- Sequans Communications Uses VeriSilicon's ZSP Core for WiMAX/LTE Products
- Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
- PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC
Latest News
- Arteris Deployed by Speedata for Data Center Compute
- Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation
- Mach42 Completes £7M Funding Round, Led by IP Group With Investment From BGF and Foresight Group
- ELECTRA IC Unveils Comprehensive IP Core Suite for Next-Generation Post-Quantum Cryptography
- CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options