BitSim and Ericsson signs Master Agreement
December 16, 2005 -- Ericsson and BitSim now strengthen their existing cooperation through the Master agreement where BitSim supplies qualified Electronic Design services.
"The agreement enables BitSim to work closer with Ericsson's design teams supporting the projects with leading edge competence" says Anders Sivard, CEO of BitSim AB.
BitSim is a leading consultant and design house in Sweden focusing on electronic design and embedded SW for Board and Chip development. The company has one of Sweden's largest independent electronics development groups.
Four key areas are Chip Design, Digital Signal Processing, High-Speed Design, and Video/Graphics.
"The agreement enables BitSim to work closer with Ericsson's design teams supporting the projects with leading edge competence" says Anders Sivard, CEO of BitSim AB.
BitSim is a leading consultant and design house in Sweden focusing on electronic design and embedded SW for Board and Chip development. The company has one of Sweden's largest independent electronics development groups.
Four key areas are Chip Design, Digital Signal Processing, High-Speed Design, and Video/Graphics.
Related Semiconductor IP
Related News
- Huawei and Ericsson Sign Long-Term Patent Cross-Licensing Agreement
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Ericsson boosts the Bluetooth market
- Virage supplies embedded memory technology to Ericsson Microelectronics
Latest News
- proteanTecs and GUC Expand Collaboration to Provide Lifecycle Health and Performance Monitoring for Custom SoCs
- Cadence Expands ChipStack AI Super Agent with a New Agent for RTL Generation and Early PPA Optimization
- IPrium releases PCM/FM Demodulator for Aerospace Telemetry
- Nanoveu Gets First 16nm ECS-DoT Silicon from TSMC
- GUC Announces 2nm 16 Gbps HBM4E IP