Baseband & Application Processors on a Single Die Changing Cellphone Chip Market Dynamics
New Forward Concepts Report Claimed to be the Most Detailed Available.
Mesa, AZ, U.S.A. July 19, 2011: Forward Concepts has announced the publication of its newest study of the worldwide market for the principal chips that enable cellphones. The new study, “Cellphone Core Chip Trends,” provides an in-depth market analysis of baseband, application processor, RF & power management chips. The study provides detailed forecasts by technology of these core cellular handset chips.
Importantly, the study estimates 2010 market shares of chip vendors and forecasts each chip type in units, average selling price and revenue through 2015. Market metrics and company profiles are the central focus of the study, and cellphone core chip markets for 2010 were:
-
Baseband chips in three main classes constitute the largest non-memory cellphone chip market at $12.7 billion.
-
Power management units are critical companions for all cellphone processors to enable efficient operation and long battery life. They reached $4.5 billion.
-
RF transceivers are increasingly complex as LTE and new 2G/3G/LTE multi-mode devices emerge. That market reached $3.7 billion.
-
RF power amplifiers also have to cope with increasingly complex multi-band operation and revenues for them reached $2.8 billion.
-
Stand-alone application processors reached $1.6 billion, but many more were part of the $3.9 billion market for communication processors that consist of both baseband and application processors on the same die or in the same package.
-
The highest expected 2011 growth rate in core cellphone chips are LTE basebands at 800%.
According to the principal author, Carter L. Horney, "It is folly to separate basebands and application processors as separate markets, since stand-alone basebands constitute only just over half of that market…since integrated basebands and application processors on the same die are a growing trend. Think Snapdragon from Qualcomm and combo chips by Texas Instruments for Nokia."
Will Strauss, Forward Concepts’ president and contributor to the report, said, "We are confident that this study provides the comprehensive information needed for new business planning."
The new 281-page report is available electronically (PDF) and details are at http://fwdconcepts.com/cellcore
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Sequans Speeds Tapeout of 65-Nanometer Mobile WiMAX Single Die Baseband Chip with Cadence Low-Power Solution
- MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids
- EXTOLL collaborates with ERIDAN as a Key Partner for Lowest Power High-Speed SerDes IP on GlobalFoundries’ 22FDX
- Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release