Automakers Will Go Fabless
Forget Hyundai, think Magnapple for iCar
EETimes (March 5, 2021)
Today, no one would question a semiconductor company that designs but doesn’t make its own chips. How is that different from an automaker that designs but doesn’t make its own cars? It isn’t. Automakers will go fabless.
As AMD co-founder and past CEO Jerry Sanders once remarked “Real men have fabs.” The only conclusion I draw from that statement is that semiconductor fabrication is perhaps the one example in nature of human males competing for bragging rights as to who has the smallest feature size.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Fabless firms outpace IDMs in costs, gross margins
- New Fabless Semiconductor Company, Ambric, Inc., Brings on Jerry Ardizzone, Former President of ARM USA as VP of Sales
- ICC Offers Java-Optimized ARM Processor-Based Platform To Fabless Consumer Electronics Designers
- Tips for the fabless
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release