ARM boost in $100bn Stargate data centre project
By Nick Flaherty, eeNews Europe (January 22, 2025)
ARM and its owner Softbank are a key partners in a datacentre infrastructure programme called Stargate.
The project, with Nvidia as the chip supplier alongside Microsoft, Oracle and OpenAI, will see an investment of $100bn for a series of data centres starting with a site in Texas. The deal could be as large as $500bn over the next four years.
“It’s a pretty big deal,” said Rene Haas, CEO of ARM. “It’s probably the largest infrastructure investment in history, You need a lot of land, a lot of compute and power and that’s where ARM comes in.”
The datacentres will use the Grace Blackwell superchip that combines the existing Grace processor with 72 or 144 ARM Neoverse V2 cores launched back in 2021 alongside the latest Blackwell GPU chip with 208bn transistors in two chips. Nvidia also offers a 120kW rack as an industry standard with the Grace Blackwell superchips.
“With Grace Blackwell the CPU is ARM. The vision of Softbank has been instrumental in making this happen,” said Haas “There’s a lot of work required to get all the permits done and regulations to be fast tracked to make all of this happen.”
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Arm Neoverse platform integrates NVIDIA NVLink Fusion to accelerate AI data center adoption
- SureCore announces low power cryogenic memory technology that could help dramatically cut data centre power usage
- AI Software Startup Moreh Partners with AI Semiconductor Company Tenstorrent to Challenge NVIDIA in AI Data Center Market
- Cadence Expands Digital Twin Platform Library with NVIDIA DGX SuperPOD Model to Accelerate AI Data Center Deployment and Operations
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release