Amkor licenses flip-chip wafer-bumping technology from Unitive

Amkor licenses flip-chip wafer-bumping technology from Unitive
By Semiconductor Business News
April 10, 2000 (10:31 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000410S0015

WEST CHESTER, Pa. -- Amkor Technology Inc. here said today that it is licensing electroplated wafer-bumping capability from Unitive Advanced Semiconductor Packaging, based in Research Triangle Park, N.C. The technology covered under the 10-year technology transfer and licensing agreement complements Amkor's internal wafer bumping manufacturing line planned for Korea.

Under the agreement, Amkor said, it will be able to provide a comprehensive set of flip-chip solutions, including flip chip bumping for silicon, silicon germanium (SiGe), gallium arsenide (GaAs), and other non-silicon die technology; a second source for solder bumping; multi-level copper redistribution; wafer-level chip scale package (CSP) technology; and fine-pitch capability. Flip chip technology is taking off with the increasing demand for high-performance handheld applications.

"Unitive's technology broadens the range of advanced processes we can offer our customers," said Rich ard Groover, vice president of flip chip technology for Amkor. "The Unitive technology allows us to address tighter pitches typical of newer die footprints and gives us a head start on the demands we foresee in the future."

Wafer bumping technology enables flip-chip packaging that uses solder or other conductive balls attached to a die to form the connection between the die and the package, replacing traditional wire bonding. OEMs increasingly are using electroplated solder deposition for advanced packaging applications. Unitive's technology meets industry requirements for solder deposition control, bump uniformity, reliability and low-alpha processing, and is also extendable to 300-mm wafers.

Electroplated-based wafer bumps are compatible with new copper ICs and high speed GaAs devices, as well as the tighter spacing between die bonding pads seen on many new 0.25- and 0.18-micron devices. Groover said Unitive's technology, along with Amkor's flip-chip technologies, enables the company to support the se growing requirements.

"Amkor's selection of our technology for their new wafer bumping line in Korea is confirmation of the industry view that electroplating-based technology will enable flip chip packaging for more non-silicon and wireless applications," said Robert Lanzone, vice president of sales and marketingfor Unitive. "Additionally, our ability to perform redistribution with copper in a single or multi-level scheme is considered an essential technology for this market. We can supplement Amkor's internal capability with our North American and Taiwan production lines to provide multi-sourcing," he said.